Copper Electroplating Technology for Microvia Filling

摘要

This paper describes a copper electroplating enabling technology for filling microvias.rnDriven by the need for faster, smaller and higher performance communication and electronic devices, build-up technologyrnincorporating microvias has emerged as a viable multilayer printed circuit manufacturing technology. Increased wiringrndensity, reduced line widths, smaller through-holes and microvias are all attributes of these High Density Interconnect (HDI)rnpackages.rnFilling the microvias with conductive material allows the use of stacked vias and via in pad designs thereby facilitatingrnadditional packaging density. Other potential design attributes include thermal management enhancement and benefits forrnhigh frequency circuitry. Electrodeposited copper can be utilized for filling microvias and provides potential advantages overrnalternative via plugging techniques.rnThe features, development, scale up and results of direct current (DC) and periodic pulse reverse (PPR) acid copper via fillingrnprocesses, including chemistry and equipment, are described.