Insights into HF-Last Processes and Particle Performance in a Single Wafer Spin Cleaning Tool

摘要

A study was conducted to identify the key factors for controlling particle contamination on HF-processed wafers on a single wafer spinner. The concentration of HF and IPA vapor was found to play a key role in achieving satisfactory particle performance. The degree of "hydrophobicity" (as measured by the combination of HF concentration and etch time) is also critical in order to produce low particle counts. The rotational speed during rinsing was found to have significant effects on particle results as well. The data also showed that excessive dissolved gases in rinse water and improper chamber airflow were not in favor of particle performance for HF-last processes.