SPIN CUP OF SINGLE-WAFER CLEANING AND DRYING APPARATUS FOR SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a spin cup of a single-wafer processing type cleaning and drying apparatus for semiconductor wafers, by whose structure a wafer is prevented from being contaminated due to the eddy air-flow generated by rotating apparatus at a high speed, when drying the wafer.;SOLUTION: A spin cup 17 of this single-wafer cleaning and drying apparatus for semiconductor wafers is provided in the surrounding of a rotating table 12 for mounting thereon a semiconductor wafer W, so that the cleaning liquid of the wafer W is not sputtered to the outside of the apparatus during cleaning and drying the wafer W, and there are formed respectively as its upper and lower portions a cylindrical neck portion 17a and a cup-form portion 17b expanded downward. Furthermore, porous members 2 are attached to the prescribed ranges of the inner surfaces of the neck portion 17a and the cup-form portion 17b and a plurality of fins 3 are attached to the prescribed positions of the inner surface of the cup-form portion 17b, while forming respectively prescribed angles to the inner surface so that the air flows generated when rotating the rotational table 12 move downward.;COPYRIGHT: (C)2001,JPO