Global Planarization Technique/CMP by High Precision Polishing and Its Characteristics

摘要

A study has been conducted to pursue the possibility of introducing high precision polishing techniques and its relevant equipment into the planarization of LSI device wafers . A new kinematic mechanism and polishing pad have been developed and integrated into a new prototype equipment built for the realization of global planarization. By employing this equipment, we experimentally polished the model device wafer and obtained remarkably better characteristics than ever in terms of planarity, uniformity, etc.,. This result has revealed us the possibility of incorporating high precision polishing process into semiconductor manufacturing machines.