首页> 外文会议>International Symposium on Microelectronics; 20050925-29; Philadelphia,PA(US) >A Dielectric Resonator Buried in a Layered Polymer Package
【24h】

A Dielectric Resonator Buried in a Layered Polymer Package

机译:埋在分层聚合物封装中的介电共振器

获取原文
获取原文并翻译 | 示例

摘要

Dielectric resonators have found widespread usage in many microwave devices such as low phase noise oscillators and low insertion loss filters. However, the integration of dielectric resonators in portable microwave devices is difficult due to the isolation and shielding requirements for proper, stable operation of the dielectric resonator. This paper discusses an alternative method for the integration of a dielectric resonator in a microwave circuit. By burying the dielectric resonator inside a host substrate, the proper shielding and isolation of the dielectric resonator can be achieved. Also, even though the resonator is surrounded by a relatively lossy substrate, a high Q resonator with a measured unloaded Q of approximately 2700 can be obtained.
机译:介电共振器已在许多微波设备中得到广泛使用,例如低相位噪声振荡器和低插入损耗滤波器。然而,由于对介电谐振器的正确,稳定操作的隔离和屏蔽要求,在便携式微波设备中将介电谐振器集成是困难的。本文讨论了在微波电路中集成介电共振器的另一种方法。通过将介电共振器埋在主体衬底内,可以实现介电共振器的适当屏蔽和隔离。而且,即使谐振器被相对损耗的衬底围绕,也可以获得具有测量的空载Q约为2700的高Q谐振器。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号