Single-Wafer Processing: Opportunities and Challenges

摘要

As has been demonstrated in the MMST Program, it is technically feasible today to fabricate integrated circuits with all single-wafer processes. However, this won't becomernstandard practice in high-volume manufacturing until it provides the lowest cost per chip. Before we reach that point, some companies may implement smaller fabs with essentially full single-wafer processing to address special requirements for short time-to-market, product/process flexibility, or capital affordability. Ultimately, 100% single-wafer processing may be available in "clusterable" modules with comparable process times. At that point, our integrated-circuit factories may be designed and operated in ways quite different from traditional practice.