Direct Dry Film Optical Bonding - A Low Cost, Robust and Scalable Display Lamination Technology

摘要

Rockwell Collins has developed a robust, repeatable, low cost lamination process that utilizes a "dry bond" approach (using PSA) to directly couple substrates to displays such as LCDs, OLEDs and Electrophoretic. These substrates can vary in intent and can serve as protective covers, reflection mitigation, heaters, filters, touch screens, environmental barriers, etc. The resultant assembly is very rugged; shock, impact, and vibration resistant, while maximizing optical performance. The paper discusses the dry film lamination approach and compares it to traditional "liquid" lamination technologies. A section of the paper will focus on the enhanced optical and environmental performances of Rockwell Collins dry film bonded displays. In addition, the flexibility of this technology will become apparent with further discussions of proven applications and scalability.