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A comparison between SiO_2/4H-SiC interface traps on (0001) and (1120) faces

机译:(0001)和(1120)面上的SiO_2 / 4H-SiC界面陷阱的比较

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摘要

We present thermally stimulated current (TSC) measurements made on metal-oxide-semiconductor (MOS) structures fabricated on off-axis (0001) or on-axis (1120) face n-type 4H-SiC with wet or dry oxides. The TSC measurements show the interface trap spectra of traps with activation energies in the range from 0.1 to 0.6 eV. Varying the charging and discharging conditions, we are able to distinguish between two types of traps which are both present on (0001) and (1120) face samples. One type is sensitive to the electric field during discharging but is insensitive to the charging temperature, while the other type is insensitive to the electric field during discharging but can not capture electrons at low temperatures. We find that, compared to the (0001) face, the traps at the (1120) face are shifted in energy about 0.1 eV towards higher activation energies. In all cases, for wet or dry oxides made on the (0001) or the (1120) face, the number density of traps is above 7xl0~(12) cm~(-2).
机译:我们介绍了在金属氧化物半导体(MOS)结构上制作的热激励电流(TSC)测量结果,该结构是在具有湿氧化物或干氧化物的n型4H-SiC的离轴(0001)或离轴(1120)表面上制造的。 TSC测量结果显示了活化能在0.1至0.6 eV范围内的陷阱的界面陷阱光谱。通过改变充电和放电条件,我们可以区分在(0001)和(1120)面部样本上都存在的两种类型的陷阱。一种对放电期间的电场敏感,但对充电温度不敏感,而另一种对放电期间的电场不敏感,但在低温下不能捕获电子。我们发现,与(0001)面相比,(1120)面的陷阱的能量朝着更高的活化能移动了约0.1 eV。在所有情况下,对于在(0001)或(1120)面上制成的湿氧化物或干氧化物,阱的数量密度都高于7x10〜(12)cm〜(-2)。

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