Inductance Calculation in Interconnect Structures

摘要

We present a package based on finite elements for two- and three-dimensional analyses of interconnect structures. Two preprocessors allow a layer-based input of the simulation geometry and the specification of the boundary conditions. Additionally, a third preprocessor provide a fully unstructered three-dimensional grid generation. The tetrahedralization engine uses a modified advancing front Delaunay algorithm. The main module calculates beside the resistances, capacitances and inductances of interconnect structures the distribution of the electric potential, the temperature and the current density. It can be applied for optimization of interconnect structures as well as for studies to verify the reliability of interconnects, as a transient-electric simulation mode is also available to calculate the capaci-tive crosstalk and delay times. As application example a spiral inductor is analyzed.