首页> 外文OA文献 >Accurate calculations of the high-frequency impedance matrix for VLSI interconnects and inductors above a multi-layer substrate:

【2h】

Accurate calculations of the high-frequency impedance matrix for VLSI interconnects and inductors above a multi-layer substrate:

机译：对于多层基板上方的VLSI互连和电感器的高频阻抗矩阵的精确计算：

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者

展开▼
作者单位

展开▼
年度 2012
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Corrections to “Analytical Expressions for High-Frequency VLSI Interconnect Impedance Extraction in the Presence of a Multilayer Conductive Substrate” [J] . Srivastava N., Xu C., Suaya R., Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on . 2010,第5期

机译：对“存在多层导电基板时高频VLSI互连阻抗提取的解析表达式”的更正
2. Analytical Expressions for High-Frequency VLSI Interconnect Impedance Extraction in the Presence of a Multilayer Conductive Substrate [J] . Srivastava N., Suaya R., Banerjee K. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on . 2009,第7期

机译：多层导电基板存在下高频VLSI互连阻抗提取的解析表达式
3. Fast High-Frequency Impedance Extraction of Horizontal Interconnects and Inductors in 3-D ICs With Multiple Substrates [J] . Xu C., Srivastava N., Suaya R., Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on . 2012,第11期

机译：具有多个基板的3-D IC中的水平互连和电感器的快速高频阻抗提取
4. High-Frequency Mutual Impedance Extraction of VLSI Interconnects In the Presence of a Multi-layer Conducting Substrate [C] . Navin Srivastava, Roberto Suaya, Kaustav Banerjee Design, Automation and Test in Europe Conference . 2008

机译：VLSI的高频互阻抗提取在多层导电基板存在下互连
5. High-frequency impedance extraction of interconnects considering substrate effects and exploration of single-walled carbon nanotubes for future VLSI interconnects. [D] . Srivastava, Navin. 2009

机译：考虑衬底效应的互连线的高频阻抗提取和用于未来VLSI互连线的单壁碳纳米管的探索。
6. Ultra-Small High-Frequency and Substrate-Immune Microtube Inductors Transformed from 2D to 3D [O] . Xin Yu, Wen Huang, Moyang Li, -1

机译：从2D转换为3D的超小型高频和基质免疫微管电感器
7. Analytical Expressions for High-Frequency VLSI Interconnect Impedance Extraction in the Presence of a Multilayer Conductive Substrate [O] . Navin Srivastava, Student Member, Roberto Suaya, 2014

机译：多层导电基板存在下高频VLsI互连阻抗提取的解析表达式

Accurate calculations of the high-frequency impedance matrix for VLSI interconnects and inductors above a multi-layer substrate:

著录项

引文网络

相似文献

相关主题

期刊订阅