首页> 外文会议>International Conference on Materials for Microelectronics; 20001016-20001017; Dublin; IE >INFLUENCE OF BORON IMPLANTATION DOSE ON THE MECHANICAL STRESS IN POLYCRYSTALLINE SILICON FILMS
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INFLUENCE OF BORON IMPLANTATION DOSE ON THE MECHANICAL STRESS IN POLYCRYSTALLINE SILICON FILMS

机译:硼注入剂量对多晶硅膜机械应力的影响

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摘要

Results are presented of a study on the boron dopant dose dependence of the mechanical stress in polycrystalline silicon (Poly-Si) films using Raman spectrometry. Depending on the dose of the boron implantation, a Raman shift from 0.2 to 3.0 cm~(-1) is observed, corresponding with a stress in the Poly-Si films between 50 to 750 MPa. It has also been observed that in these lowly doped Poly-Si films, there exists a maximum value of the mechanical stress with B-dose. The physical mechanism resulting in a lower stress for higher doping levels is unclear as yet.
机译:提出了使用拉曼光谱法研究多晶硅(Poly-Si)薄膜中机械应力对硼掺杂剂量依赖性的研究结果。取决于硼注入的剂量,观察到拉曼位移从0.2到3.0cm 2(-1),对应于多晶硅膜中的应力在50到750MPa之间。还已经观察到在这些低掺杂的多晶硅膜中,存在B剂量的机械应力的最大值。尚不清楚导致较高掺杂水平的较低应力的物理机制。

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