Heat treatment of Inserts on The encapsulation mould for Semiconductor devices

摘要

The treatise outlines the structure of plastic encapsulation mould for semiconductor device and its importance in the production. The mould is precise electronic mould. Its quality is concentrated on the inserts. Brief introduction to the evolvement of modern steels used for inserts and today used steels. Reports the results of research and development on heat treatment technics for today used steels. Recommends the technics of heat treatment for those steels used to make inserts of encapsulation mould.