Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components

摘要

The invention relates to a mould for encapsulating electronic components mounted on a carrier, comprising at least two mould parts which are displaceable relative to 5 each other, at least one of the mould parts with a mould cavity recessed in a contact side, which mould parts are configured to engage with the mould cavity round the electronic components to be encapsulate, wherein at least a part of the mould cavity is formed by an insert having a flexible three-dimensional moulding surface facing the electronic components. The invention further relates to an insert 10 for use in said mould and a method for encapsulating electronic components mounted on a carrier using said mould. 2021145