首页> 外文会议>International Conference on Defects in Semiconductors; 20070722-27; Albuquerque,NM(US) >Probing defects at interfaces and interlayers of low-dimensional Si/insulator (HfO_2; LaAlO_3) structures by electron spin resonance
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Probing defects at interfaces and interlayers of low-dimensional Si/insulator (HfO_2; LaAlO_3) structures by electron spin resonance

机译:通过电子自旋共振探测低维Si /绝缘体(HfO_2; LaAlO_3)结构的界面和中间层的缺陷

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Electron spin resonance (ESR) spectroscopy enables to assess on atomic scale the nature and structural aspects of interfaces and interlayers in semiconductor/insulator hetero structures. This has been applied to (10 0)/insulator entities with nrn-thin amorphous layers of HfO_2 and LaAlO_3 of high dielectric constant (> 12) grown on clean (100)Si by atomic layer chemical vapor deposition and molecular beam deposition, respectively. Through analysis and monitoring of the occurring embedded paramagnetic point defects, including P_b-type defects, E', and EX, as a function of VUV irradiation and post-deposition heat treatment, basic information as to the nature, quality, and thermal stability of the interface and interfacial regions has been attained. On the basis of the analysis of P_b-type defects (P_(b0), P_(b1)), archetypal for the Si/SiO_2 interface, the (100)Si/LaAlO_3 stack is found to be truly abrupt, i.e., no evidence for an Si/SiO_(2(x))-type transition in contrast with the Si/HfO_2 entity, where the interface is found to be Si/SiO_(2(x))) type in the as-grown state. Analysis as a function of post-deposition heating indicates the Si/LaAlO_3 interface to remain stable and abrupt up to T_(an)~800 ℃, above which an Si/SiO_2-type interface develops, while that in Si/HfO_2 evolves to one of closely standard Si/SiO_2 quality, with an SiO_2 interlayer of good quality. The differences in behavior of the studied Si/insulator stacks are discussed in a comparative analysis.
机译:电子自旋共振(ESR)光谱能够在原子尺度上评估半导体/绝缘体异质结构中界面和中间层的性质和结构方面。这已应用于通过原子层化学气相沉积和分子束沉积分别在干净的(100)Si上生长且具有高介电常数(> 12)的HfO_2和LaAlO_3的nrn薄非晶层的(10 0)/绝缘体实体。通过分析和监视所发生的嵌入的顺磁点缺陷(包括P_b型缺陷,E'和EX),作为VUV照射和沉积后热处理的函数,可以提供有关VN的性质,质量和热稳定性的基本信息界面和界面区域已实现。根据对Si / SiO_2界面原型的P_b型缺陷(P_(b0),P_(b1))的分析,发现(100)Si / LaAlO_3叠层确实是突变的,即没有证据Si / SiO_(2(x))型跃迁与Si / HfO_2实体相反,在该状态下,界面处于成长期状态为Si / SiO_(2(x)))型。根据沉积后加热的函数分析表明,Si / LaAlO_3界面在T_(an)〜800℃时保持稳定并突然变化,在此温度之上,Si / SiO_2型界面逐渐形成,而在Si / HfO_2中则演变为一种界面。具有接近标准的Si / SiO_2质量,并具有优质的SiO_2中间层。在比较分析中讨论了所研究的硅/绝缘体堆叠的行为差异。

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