The Numerical Simulation of a Subtractive Process for the Fabrication of 3D Low Temperature Co-Fired Ceramics Packaging Structures and Devices: Jet Vapor Etching

摘要

We applied numerical simulation in order to gain knowledge and insight into the physical processes associated with Jet Vapor Etching, a subtractive process used in the machining of Low Temperature Co-Fired Ceramic (LTCC) tapes. Also, we performed a series of time independent (steady state) simulations of the process reactor, dividing the reactor in three parts and using the results of each part as to define the boundary conditions of the subsequent part. Furthermore we explore the dependence of the machined feature size on the pressure, temperature, distance from the micro-machined silicon nozzle to the LTCC tape, and nozzle geometry. We display velocity vector as well as density gradient profiles combined with distance dependence to substantiate the argument in our narrative.