Progress of Research in Slicing Technology of Large-Scale Silicon Wafers

机译：大型硅片切片技术研究进展

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摘要

This paper introduces and summarizes the slicing technology of large-scare silicon wafers. And the research status of ID slicing, wire saw slicing and WEDM is summed up. Finally, this document indicates the direction of research and the development.

机译：本文介绍并总结了大面积硅片的切片技术。总结了ID切片，线锯切片和线切割加工的研究现状。最后，该文件指出了研究和发展的方向。

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来源
《International Conference on Advances in Machining amp; Manufacturing Technology in China; 20070816-19; Harbin(CN)》|2007年|P.15|共2页
会议地点 Harbin(CN)
作者
Ligang Zhao; Dunwen Zuo; Yuli Sun;
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作者单位

College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing, China, 210016;

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会议组织
原文格式 PDF
正文语种 eng
中图分类机械制造工艺;
关键词
WEDM; silicon wafer; ID slicing; free abrasive multi-wire saw; fixed abrasive multi-wire saw;

机译：WEDM;硅片; ID切片;免打磨多线锯;固定式多线锯;

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专利

1. Progress of Research in Slicing Technology of Large-Scale Silicon Wafers [J] . Ligang Zhao, Dunwen Zuo, Yuli Sun Key Engineering Materials . 2008,第期

机译：大型硅片切片技术研究进展
2. Novel Silicon Wafer Slicing Technology Using Atmospheric-Pressure Reactive Microplasma [J] . Takuya IDENO, Hirotoshi INUI, Seigo TAKASHIMA, Japanese journal of applied physics . 2008,第7issue1期

机译：大气压反应性微等离子体的新型硅片切片技术
3. Using expert technology to select unstable slicing machine to control wafer slicing quality via fuzzy AHP [J] . Che-Wei Chang, Cheng-Ru Wu, Huang-Chu Chen Expert systems with applications . 2008,第3期

机译：利用专家技术选择不稳定切片机，通过模糊层次分析法控制晶圆切片质量
4. Progress of Research in Slicing Technology of Large-Scale Silicon Wafers [C] . Ligang Zhao, Dunwen Zuo, Yuli Sun International Conference on Advances in Machining Manufacturing Technology in China . 2008

机译：大型硅晶片切片技术研究进展
5. An investigation of wire electrical discharge machining (WEDM) of p-doped elemental semiconductors for wafer slicing and high-aspect-ratio microfabrication. [D] . Rakwal, Dinesh. 2009

机译：对用于晶片切片和高纵横比微加工的p掺杂元素半导体的电火花线切割加工（WEDM）的研究。
6. Aerosol-Assisted Extraction of Silicon Nanoparticles from Wafer Slicing Waste for Lithium Ion Batteries [O] . Hee Dong Jang, Hyekyoung Kim, Hankwon Chang, -1

机译：气溶胶辅助提取硅片电池晶片切片废料中的硅纳米颗粒
7. Silicon ingot casting: heat exchanger method (HEM). Multi-wire slicing: fixed abrasive slicing technique (FAST). Phase IV. Silicon sheet growth development for the large area sheet task of the low-cost solar array project. Quarterly progress report No. 3, July 1, 1980-September 30, 1980 [O] . F Schmid, C P Khattak, M Basaran 1980

机译：硅锭铸件：换热器法（下摆）。多线切片：固定磨料切片技术（快速）。第四阶段。低成本太阳能阵列工程大面积纸芯片生长开发。 1980年7月1日，1980年7月1日季度进展报告
8. Silicon Ingot Casting: Heat Exchanger Method Multi-Wire Slicing, Fixed Abrasive Slicing Technique. Phase IV. Silicon Sheet Growth Development for the Large Area Sheet Task of the Low-Cost Solar Array Project. Quarterly Progress Report No. L, December 15, [R] . Schmid, F., Khattak, C. P. 1980

机译：硅锭铸造：热交换器方法多线切片，固定磨料切片技术。第四阶段。低成本太阳能电池阵项目大面积工作的硅片增长发展。 12月15日L号季度进展报告，

Progress of Research in Slicing Technology of Large-Scale Silicon Wafers

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