The Effect of CMP conditioner design

摘要

Mitsubishi Materials Corporation (MMC) is producing many kinds of CMP conditioners (Fig.1) for several kinds of CMP equipment. In our long history of Ni plated CMP conditioner, our main stream was dot designed conditioner (Fig.2) by the blocky diamond. The reason to use the blocky diamond is mainly to reduce the number of the defect on the wafer. Our dot designed CMP conditioners are used by many customers for the issue of the defect. However, some users are afraid of the use of the blocky diamond, because there is the issue of the low pad wear rate. We believe the high wafer removal rate is not caused by the high pad wear rate. We researched CMP conditioner for the high wafer removal rate by the use of the blocky diamond. We conclude we can design CMP conditioner by the use of the blocky diamond for the high wafer removal rate. The effect of CMP conditioner design may be important factor.