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Vacancies in Growth-rate-varied CZ Silicon Crystal Observed by Low-temperature Ultrasonic Measurements

机译:低温超声测量观察到的生长速率可变的CZ硅晶体中的空位

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The low-temperature ultrasonic experiments are performed to measure the distribution of vacancy concentration in the ingot of the Czochralski (CZ) silicon crystal grown with the pulling rate gradually lowered. The elastic softening similar to that we recently found for the floating-zone-grown silicon crystals is observed for the so-called vacancy-rich region of the ingot which contains no voids or dislocation clusters. We further uncover that the interstitial-rich region in the ingot exhibits no such elastic softening, confirming our previous conclusion that the defects responsible for the low-temperature elastic softening are the vacancies. We also disclose that the elastic softening is absent for the ring-like oxidation stacking fault (R-OSF) region of the ingot. The measured distribution of the vacancy concentration indicates that the minority point defects are perfectly cancelled by the majority point defects during the CZ crystal growth.
机译:进行低温超声实验,以测量随着拉速逐渐降低而生长的切克劳斯基(CZ)硅晶体晶锭中空位浓度的分布。对于所谓的晶锭的富含空位的区域,观察到类似于我们最近对于浮区生长的硅晶体的弹性软化,该区域不包含空隙或位错簇。我们进一步发现,晶锭中的填隙丰富的区域没有这种弹性软化,这证实了我们先前的结论,即造成低温弹性软化的缺陷是空位。我们还公开了锭的环状氧化堆叠缺陷(R-OSF)区域不存在弹性软化。空位浓度的测量分布表明,在CZ晶体生长期间,少数点缺陷已被多数点缺陷完全抵消。

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