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Contribution to scaling of Vertical-Slit Field-Effect Transistor (VeSFET)

机译:有助于垂直狭缝场效应晶体管(VeSFET)的缩放

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A Junction-less twin-gate Vertical-Slit Field-Effect Transistor (VeSFET) is the elementary component of a new 3D VeSTIC technology [1]. Feasibility studies conducted until now indicate that VeSTIC architecture has the potential to overcome many barriers of ICs scaling in the deep-submicron era. As it was shown earlier, electrical properties of VeSFETs seems to be very attractive, but simulations [5] indicate different correlations between electrical and structure parameters in comparison with those of MOSFETs which operate in inversion mode. In this paper the exploration of the VeSFET parameters space has been developed and preliminary scaling recommendations are formulated.
机译:无结双栅极垂直缝场效应晶体管(VeSFET)是新型3D VeSTIC技术的基本组成部分[1]。迄今为止进行的可行性研究表明,VeSTIC架构具有克服深亚微米时代IC扩展规模的许多障碍的潜力。如前所述,VeSFET的电学特性似乎非常吸引人,但仿真[5]表明,与以反相模式工作的MOSFET相比,电学和结构参数之间存在不同的相关性。在本文中,已经开发了对VeSFET参数空间的探索,并提出了初步的缩放建议。

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