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Low Temperature Growth of GaAs on Si Substrates for Ultra-fast Photoconductive Switches

机译:超快光电导开关的Si衬底上GaAs的低温生长

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We have grown GaAs directly on silicon substrates by molecular beam epitaxy (MBE) at low substrate temperatures (~250 ℃). The silicon wafer surface cleaning and GaAs film growth processes were done at temperatures lower than the Si-Al eutectic temperature, in order to enable monolithic integration of low-temperature-grown-GaAs (LT-GaAs) photoconductive switches with Si-CMOS circuits. In situ reflection high-energy electron diffraction (RHEED), ex situ x-ray diffraction (XRD) and atomic force microscopy (AFM) studies were performed to characterize the LT-GaAs film quality. The film surfaces show less than 1 nm root-mean-square (rms) roughness and the anti-phase domain (APD) density is below the XRD detection limit. Metal-semiconductor-metal (MSM) photoconductive switches were made using this material. A time-resolved electro-optic sampling technique was used to determine the responsivity and speed of the switches. A full-width at half-maximum (FWHM) switching time of ~2 picoseconds was achieved and the responsivity of switches made from LT-GaAs on Si material was comparable to that of switches made from LT-GaAs on GaAs material.
机译:我们已经在较低的衬底温度(约250℃)下通过分子束外延(MBE)在硅衬底上直接生长了GaAs。为了使低温生长的GaAs(LT-GaAs)光电导开关与Si-CMOS电路实现单片集成,在低于Si-Al共晶温度的温度下进行了硅晶片表面清洁和GaAs膜生长工艺。进行了原位反射高能电子衍射(RHEED),异位X射线衍射(XRD)和原子力显微镜(AFM)研究,以表征LT-GaAs薄膜的质量。膜表面显示出小于1 nm的均方根(rms)粗糙度,并且反相域(APD)密度低于XRD检测极限。使用这种材料制成了金属-半导体-金属(MSM)光电导开关。使用时间分辨电光采样技术确定开关的响应度和速度。实现了约2皮秒的半峰全宽(FWHM)切换时间,并且由LT-GaAs制成的Si材料上的开关的响应性与由LT-GaAs制成的GaAs材料上的开关的响应性相当。

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