Design Considerations for Inkjet Printed Electronic Interconnections and Packaging

摘要

Printed electronics is a rising technology for electronics integration and manufacturing. The technology can provide some fundamental improvements in system integration and conventional interconnection technologies, such as premanufactured interposer PCB and wire bonding. Utilization of the drop-on-demand inkjet printer in microelectronics packaging has been done at Tampere University of Technology to create chip scale package multilayer interconnections. Inkjet printer combined with metallo-organic decomposition was utilized replacing conventional wire bonding and premanufactured PCB. Design considerations for digital printing in electronic interconnections are somewhat different compared to conventional technologies. Traditionally, electronics have been designed using continuous vector graphics, but the inkjet printing requires a binary pattern file for printing. Due to early phase of inkjet development cause the need for equipment adjustments and new design rules. Printing accurately fine conductive traces require a proper jetting algorithm and device parameter optimization. General high-speed design rules are valid also when considering printed electronics, but they must be adapted to new technology demands. Moving towards process based manufacturing gives the designer more possibilities in the design, as inkjet printing is a flexible fluid deposition process and enables dynamic structure creation. The research activities have related to inkjet technology capabilities for electronics integration. Design rules for drop-on-demand inkjet printing have been created during technology evaluation and results prove the trueness of conclusions reached.