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Elimination of Surface Defects For Printable High Density Gold Conductor Pastes

机译:消除可印刷高密度金导体浆料的表面缺陷

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摘要

Surface defects for screen-printed gold conductors were investigated in order to identify their root causes. Several mechanisms were proposed to explain different types of surface defects, such as domes or blisters. Using these mechanisms, modifications to the paste formulation and the manufacturing process were established to prevent these defects. The new methodology provided several gold conductor pastes with defect free surfaces and lower cost to use.
机译:为了确定其根本原因,对丝网印刷金导体的表面缺陷进行了研究。提出了几种机制来解释不同类型的表面缺陷,例如圆顶或水泡。使用这些机制,可以对糊剂配方和制造工艺进行修改,以防止出现这些缺陷。新方法提供了几种具有无缺陷表面且使用成本较低的金导体浆料。

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