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Advancing materials processing, eliminating current limiting mechanism, and enhancing critical current density of silver-sheathed Bi-2223 composite conductors .

机译:推进材料加工,消除限流机制并提高银鞘Bi-2223复合导体的临界电流密度。

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摘要

Major current-limiting mechanisms (CLMs) restrict the critical current density Jc of Ag-sheathed (Bi,Pb)2Sr 2Ca2Cu3Ox (2223) composite conductors. Overpressure (OP) processing of 2223 has been developed to enhance the connectivity and thus the Jc by removing the CLMs of porosity, cracks, and Bi2Sr2Ca,Cu2Ox (2212) in 2223. OP processing improved the microstructure of 2223 tapes and increased their Jc by about 30%. Record Jc enhanced irreversibility field, and the lowest 2212 SQUID index have been achieved in OP processed 2223 tapes. OP processing improved 2223 connectivity and resulted in higher local Jc and a larger number of high Jc local regions compared to conventional 1 bar processing. OP processing has been applied on the thermal slide heat treated (TSHT) 2223 tapes. It was found that adding a rolling step to the TSHT samples prior to OP processing increased the Jc and irreversibility field. Quenching experiments have been carried out to gain better understanding of the role of residual liquid, which is another CLM, the formation of Pb-rich (Bi,Pb)3Sr2Ca2Cu1Ox (3221) phase in the post anneal process, and their correlations to the electromagnetic properties of 2223. Jc and irreversibility field were enhanced by the PA, in which the 3221 was formed. The improvement of Jc and irreversibility field was strongly correlated to the removal of residual liquid by crystallizing the liquid and forming 3221 and other phases. The 3221 was observed to begin forming in the heating step of the PA and significantly increased in the soaking step. Well-defined variations of the Jc irreversibility field, and Tc as a function of quenching temperature were observed during the 2223 processing. These variations were attributed to the removal/reforming of residual liquid and the changes of oxygen and Pb content in the 2223 and 2212.
机译:主要的限流机制(CLM)限制了Ag护套(Bi,Pb)2Sr 2Ca2Cu3Ox(2223)复合导体的临界电流密度Jc。已经开发出2223的过压(OP)处理来增强连通性,从而通过消除2223中的孔隙,裂纹和Bi2Sr2Ca,Cu2Ox(2212)的CLM来增强Jc。OP处理改善了2223胶带的微观结构,并提高了Jc约30%记录Jc增强了不可逆性字段,并且在OP处理的2223磁带中实现了最低的2212 SQUID指数。与传统的1 bar处理相比,OP处理改善了2223连接性,并导致更高的局部Jc和更多的高Jc局部区域。 OP处理已应用于热载玻片热处理(TSHT)2223磁带。已发现在OP处理之前向TSHT样品添加滚动步骤会增加Jc和不可逆性字段。已经进行了淬火实验,以更好地了解残余液体的作用,这是另一种CLM,在退火后过程中形成富Pb(Bi,Pb)3Sr2Ca2Cu1Ox(3221)相的过程及其与电磁的相关性2223. PA增强了Jc和不可逆性场,形成了3221。 Jc和不可逆场的改善与通过使液体结晶并形成3221和其他相而去除残留液体密切相关。观察到3221在PA的加热步骤中开始形成,并在均热步骤中显着增加。在2223处理期间,观察到Jc不可逆场的明确定义的变化以及Tc作为淬火温度的函数。这些变化归因于残留液体的去除/重整以及2223和2212中氧气和Pb含量的变化。

著录项

  • 作者

    Yuan, Yongwen.;

  • 作者单位

    The University of Wisconsin - Madison.;

  • 授予单位 The University of Wisconsin - Madison.;
  • 学科 Engineering Materials Science.; Engineering Metallurgy.
  • 学位 Ph.D.
  • 年度 2004
  • 页码 161 p.
  • 总页数 161
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工程材料学;冶金工业;
  • 关键词

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