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Master-Clone Placement with Individual Clock Tree Implementation – a Case on Physical Chip Design

机译:具有单独时钟树实现的主克隆放置–以物理芯片设计为例

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A hybrid design approach of the hierarchical physical implementation design flow is presented and demonstrated on a fault-tolerant low-power multiprocessor system. The proposed flow allows to implement selected submodules in parallel with contrary requirements such as identical placement and individual block implementation. The overall system contains four Leon2 cores and communicates via the Waterbear framework and supports Adaptive Voltage Scaling (AVS) functionality. Three of the processor core variants are derived from the first baseline reference core but implemented individually at block level based on their clock tree specification. The chip is prepared for space applications and designed with triple modular redundancy (TMR) for control parts. The low-power performance is enabled by contemporary power and clock management control. An ASIC is fabricated in a low-power 0.13 μm BiCMOS technology process node.
机译:在容错低功耗多处理器系统上,提出并演示了分层物理实现设计流程的混合设计方法。所提出的流程允许与相反的要求(例如相同的放置和单独的模块实现)并行地实现选定的子模块。整个系统包含四个Leon2内核,并通过Waterbear框架进行通信,并支持自适应电压缩放(AVS)功能。处理器内核变体中的三个派生自第一个基准参考内核,但根据其时钟树规范在模块级别分别实现。该芯片是为太空应用准备的,并为控制部件设计了三重模块冗余(TMR)。通过现代电源和时钟管理控制来实现低功耗性能。 ASIC是在低功耗0.13μmBiCMOS技术工艺节点中制造的。

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