Robust hard-solder packaging of conduction cooled laser diode bars

摘要

We present the reliability of high-power laser diodes utilizing hard solder (AuSn) on a conduction-cooled package (HCCP). We present results of 50 W hard-pulse operation at 8xx nm and demonstrate a reliability of MTTF ＞ 27 khrs (90% CL), which is an order of magnitude improvement over traditional packaging. We also present results at 9xx nm with a reliability of MTTF ＞ 17 khrs (90% CL) at 75 W. We discuss finite element analysis (FEA) modeling and time dependent temperature measurements combined with experimental life-test data to quantify true hard-pulse operation. We also discuss FEA and measured stress profiles across laser bars comparing soft and hard solder packaging.