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LOADING EFFECTS DURING NON-SELECTIVE EPITAXIAL GROWTH OF Si AND SiGe

机译:Si和SiGe的非选择性外延生长过程中的载荷效应

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Loading effects were studied for non-selective epitaxial Si and SiGe films grown by chemical vapor deposition using SiH_4 and GeH_4 at 650℃ and 20 - 80 Torr. The growth rates of Si and SiGe films decreased when about 50% of the substrate surface was covered by SiO_2. While the Si epitaxy showed a growth rate smaller than the polycrystalline Si simultaneously deposited on the surrounding SiO_2, the opposite was true for the growth of SiGe. Further increasing oxide surface coverage did not lead to appreciable change in the growth rates. Neither did the doping concentration change with increasing oxide coverage, when in-situ doping with both p- and n-type dopants was performed. Theoretical calculations showed that the difference in growth rates caused by wafer temperature change due to surface emissivity variation was minor. Therefore, chemical effects were the main causes responsible for the growth rate variations.
机译:研究了在650℃和20-80托下使用SiH_4和GeH_4通过化学气相沉积法生长的非选择性外延Si和SiGe薄膜的加载效应。当约50%的衬底表面被SiO_2覆盖时,Si和SiGe薄膜的生长速率降低。尽管硅的外延生长速率小于同时沉积在周围SiO_2上的多晶硅,但SiGe的生长却相反。进一步增加氧化物表面覆盖率并没有导致增长率的明显变化。当用p型和n型掺杂剂进行原位掺杂时,掺杂浓度也不会随着氧化物覆盖率的增加而改变。理论计算表明,由于表面发射率变化引起的晶片温度变化导致的增长率差异很小。因此,化学作用是导致生长速率变化的主要原因。

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