首页> 外文会议>European Conference on Silicon Carbide and Related Materials(ECSCRM 2004); 20040831-0904; Bologna(IT) >Microstructural Characterization of 3C-SiC Thin Films Grown by Flash Lamp Induced Liquid Phase Epitaxy
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Microstructural Characterization of 3C-SiC Thin Films Grown by Flash Lamp Induced Liquid Phase Epitaxy

机译:闪光灯诱导液相外延生长3C-SiC薄膜的微观结构表征

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摘要

Thin 3C-SiC films epitaxially grown on Si-substrate are substantially improved by the FLASIC process, which involves irradiation with flash lamps with pulse duration of 20ms. The disadvantages of the standard FLASIC process are the undulations introduced in the SiC film due to melting of the Si-substrate and the Si mass transport near the SiC/Si interface during the flash. An improved structure was realised in order to minimize the undulations of the SiC, improving also the quality of the film. This structure involves the deposition of a silicon overlayer (SOL) on the initial SiC layer, followed by an additional SiC capping layer acting as a source for SiC transfer by liquid phase epitaxy to the lower SiC layer. Significant mass SiC transport from the upper to the lower SiC layer through the SOL occurs during the flash. The new structure is characterized as inverse -FLASiC. The structural characteristics of the new structure were studied by transmission electron microscopy and atomic force microscopy.
机译:外延生长在Si衬底上的3C-SiC薄膜通过FLASIC工艺得到了显着改善,该工艺涉及用20ms脉冲持续时间的闪光灯照射。标准FLASIC工艺的缺点是由于Si基板的熔化以及在闪光期间Si在SiC / Si界面附近的传质而在SiC膜中引入了起伏。为了使SiC的起伏最小化,实现了改善的结构,还改善了膜的质量。这种结构包括在初始SiC层上沉积硅覆盖层(SOL),然后是一个额外的SiC覆盖层,用作通过液相外延将SiC转移到下SiC层的源。在闪蒸过程中,大量的SiC通过SOL从上层SiC层传输到下层SiC。该新结构的特征是反-FLASiC。通过透射电子显微镜和原子力显微镜研究了新结构的结构特征。

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