Size-Dependent Melting Characteristics of Lead-free Solder Alloys in Microelectronics

摘要

With the increasing use of lead-free solder alloys, low melting point alloy is often required due to the heat-sensitive parts or substrates in modern electronic devices. For such demand of low melting point, the nanostructure lead-free solder alloy, having excellent metallurgical characteristics and a melting point of <215℃, were developed by mechanical attrition of conventional lead free solder alloys (Sn-Ag-Cu, Sn-Ag and Sn-Cu). The decrease in melting point due to nanosize effect was calculated theoretically as function of particle size and the theoretical results were compared with experimental values measured by differential scanning calorimetry. The newly developed alloys have eutectic composition of Sn-3.5Ag-0.7Cu, Sn-3.5Ag and Sn-0.7Cu and the melting point depression found to be 5.1℃, 4.1℃ and 6.2℃ when the bulk alloys reduced to 80 nm, 92nm and 96nm sizes respectively.