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Shot Noise, LER and Quantum Efficiency of EUV Photoresists

机译:EUV光刻胶的散粒噪声,LER和量子效率

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The shot noise, line edge roughness (LER) and quantum efficiency of EUV interaction with seven resists related to EUV-2D (XP98248B) are studied. These resists were identical to EUV-2D except were prepared with seven levels of added base while keeping all other resist variables constant. These seven resists were patterned with EUV lithography, and LER was measured on 100-200 nm dense lines. Similarly, the resists were also imaged using DUV lithography and LER was determined for 300-500 nm dense lines. LER results for both wavelengths were plotted against E_(size). Both curves show very similar LER behavior - the resists requiring low doses have poor LER, whereas the resists requiring high doses have good LER. One possible explanation for the observed LER response is that the added base improves LER by reacting with the photogenerated acid to control the lateral spread of acid, leading to better chemical contrast at the line edge. An alternative explanation to the observed relationship between LER and E_(size) is that shot-noise generated LER decreases as the number of photons absorbed at the line edge increases. We present an analytical model for the influence of shot noise based on Poisson statistics that predicts that the LER is proportional to (E_(size))~(-1/2). Indeed, both sets of data give straight lines when plotted this way (DUV r~2 = 0.94; EUV r~2 = 0.97). We decided to further evaluate this interpretation by constructing a simulation model for shot noise resulting from exposure and acid diffusion at the mask edge. In order to acquire the data for this model, we used the base titration method developed by Szmanda et al. to determine C-parameters and hence the quantum efficiency for producing photogenerated acid. This information, together with film absorptivity, allows the calculation of number and location of acid molecules generated at the mask edge by assuming a stochastic distribution of individual photons corresponding to the aerial image function. The edge "roughness" of the acid molecule distribution in the film at the mask edge is then simulated as a function of acid diffusion length and compared to the experimental data. In addition, comparisons between of the number of acid molecules generated and photons consumed leads to values of quantum efficiencies for these EUV resists.
机译:研究了与EUV-2D(XP98248B)相关的七个抗蚀剂的EUV相互作用的散粒噪声,线边缘粗糙度(LER)和量子效率。这些抗蚀剂与EUV-2D相同,不同之处在于,它们是在添加了七个含量的碱的同时,保持所有其他抗蚀剂变量恒定的。使用EUV光刻对这七个抗蚀剂进行构图,并在100-200 nm的密集线上测量LER。同样,也使用DUV光刻对抗蚀剂进行成像,并针对300-500 nm的密集线确定LER。将两种波长的LER结果与E_(大小)作图。两条曲线都显示出非常相似的LER行为-需要低剂量的抗蚀剂具有较差的LER,而需要高剂量的抗蚀剂具有良好的LER。观察到的LER响应的一种可能解释是,所添加的碱通过与光生酸反应来控制酸的横向扩散,从而改善了LER,从而在生产线边缘产生了更好的化学对比度。观察到的LER和E_(size)之间的关系的另一种解释是,随着线边缘吸收的光子数量的增加,散粒噪声产生的LER减小。我们提出了一种基于泊松统计的散粒噪声影响分析模型,该模型预测LER与(E_(size))〜(-1/2)成正比。实际上,当以这种方式绘制时,两组数据都给出直线(DUV r〜2 = 0.94; EUV r〜2 = 0.97)。我们决定通过构建一个模拟模型来进一步评估这种解释,该模拟模型是由掩模边缘的曝光和酸扩散引起的散粒噪声。为了获得该模型的数据,我们使用了Szmanda等人开发的碱滴定法。确定C参数,从而确定产生光生酸的量子效率。该信息与胶片的吸收率一起,通过假设对应于航拍图像功能的单个光子的随机分布,可以计算在掩模边缘生成的酸分子的数量和位置。然后模拟在掩模边缘的膜中酸分子分布的边缘“粗糙度”,作为酸扩散长度的函数,并与实验数据进行比较。此外,比较产生的酸分子的数量和消耗的光子会导致这些EUV抗蚀剂的量子效率值。

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