Study of the Copper Electrodeposition Mechanism on Molybdenum Substrate

摘要

Molybdenum substrates are mainly used for photovoltaic applications, and specifically as support for absorber deposition, for thin film solar cells. For these applications, one of the technologic key points is the electrodeposition of a copper layer. Furthermore, in the microelectronic domain, OMG Ultra Pure Chemicals (UPC) has developed a specific chemistry (OMniCu™ chemistry), enhanced by organic additives, dedicated to the copper electrodeposition on copper substrates (Damascene and Through Silicon Vias applications) (1,2). The aim of this article is to determine the efficiency of this commercial chemistry to coat a homogeneous, uniform, hiding and adherent copper layer on molybdenum substrates, with a monitoring thickness, lower than 100nm.