首页> 外文会议>Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2011 IEEE >A physics-based model of on-chip decoupling capacitor for accurate power integrity analysis
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A physics-based model of on-chip decoupling capacitor for accurate power integrity analysis

机译:基于物理的片上去耦电容器模型可进行准确的电源完整性分析

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摘要

A physics-based equivalent circuit model of on-chip decoupling capacitor for chip modelling is proposed for use in accurate power integrity (PI) analysis. The proposed model can be easily applied to on-chip decoupling capacitor design based on the construction flow. The accuracy of the model has been verified with circuit simulation. By using this model and an incomplete one, a case study of chip-package co-simulation in H-spice environment is investigated, which successfully demonstrate the purpose of the proposed model.
机译:提出了一种基于物理的片上去耦电容器等效电路模型,用于芯片建模,以用于精确的电源完整性(PI)分析。所提出的模型可以很容易地应用于基于构建流程的片上去耦电容器设计。通过电路仿真验证了模型的准确性。通过使用该模型和不完整的模型,研究了在H-spice环境中芯片封装协同仿真的案例,成功地证明了该模型的目的。

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