首页> 外文会议>Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2011 IEEE >System-level characterization of modal signaling for high-density off-chip interconnects
【24h】

System-level characterization of modal signaling for high-density off-chip interconnects

机译:高密度片外互连的模态信令的系统级表征

获取原文
获取原文并翻译 | 示例

摘要

In high-speed chip-to-chip single-ended signaling links, far-end crosstalk presents one of the dominant noise sources, limiting the link performance. Diagonalizing the channel using modal decomposition has been proposed to mitigate the crosstalk. However, a practical circuit implementation of such a transceiver system will unavoidably deviate from the ideal (crosstalk-free) eigenvalue decomposition. In this paper, the impact of modal encoder/decoder coefficient quantization, random common and uncorrelated noise on signal integrity is analyzed in terms of system-level performance metrics, SNR and BER. Also discussed is the optimal selection of decoder coefficients with respect to the input-referred noise at the receiver.
机译:在高速芯片到芯片单端信令链路中,远端串扰是主要的噪声源之一,从而限制了链路性能。已经提出了使用模态分解对角化信道以减轻串扰。然而,这种收发器系统的实际电路实现将不可避免地偏离理想的(无串扰)特征值分解。本文从系统级性能指标,SNR和BER的角度分析了模态编码器/解码器系数量化,随机公共和不相关噪声对信号完整性的影响。还讨论了相对于接收器输入参考噪声的解码器系数的最佳选择。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号