Improvement in reliability with CCGA column density increase to 1 mm pitch

摘要

Discusses reliability testing of a 1 mm pitch ceramic column grid array (CCGA) test vehicle assembly including accelerated thermal cycling, insulation resistance testing, and mechanical stress tests such as shock and vibration. The experimental matrix includes several variables such as PCB thickness. The attributes of the package and card test vehicles, along with critical assembly parameters will be discussed with a focus on the resulting reliability data. Also included in the paper will be a comparison of the 1 mm pitch CCGA assembly reliability to 1.27 mm control CCGA locations on the same test cards and to previous 1.27 mm pitch CCGA test results. The paper will discuss the test methods and results from this experiments matrix.