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Impact Analysis of Dual Material Double Gate Oxide-Stack Junction-Less MOSFET in RFID Memory Cell Realisation

机译:双材料双栅氧化物叠层结型MOSFET减少对RFID存储单元实现的影响分析

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In this proposed article, a realization of RFID memory cell has been performed using Dual Material Double Gate Stack-Oxide Junction-Less MOSFET for high speed and low power application [1] in Sub-threshold regime. SNM, Power and Delay of the Memory Cell or SRAM circuit in different operating modes have been analyzed in depth. Dual Material Double Gate Oxide-Stack Junction-Less MOSFET (DMDGS-JLT) shows promising ION/IOFF ratio, less subthreshold swing and less Drain Induced Barrier Lowering or DIBL, in comparison with Double Gate Junction-Less MOSFET. So, proposed SRAM cell would be efficacious to offer less power dissipation and higher speed and a better Static Noise Margin. The impact of DMDGS-JLT in realizing RFID memory cell or SRAM has been studied in sub-threshold regime for ultra-low power tag design. Extensive simulations are performed using SILVACO ATLAS platform to validate the analyzed models. Besides, an optimum supply voltage range has been chosen to get an ultra-low power and higher speed of operation. DMDGS-JLT can be an alternative for ultra-low power Passive-RFID tag design, which results into greater time-span of the battery.
机译:在本文中,使用双材料双栅叠层式无结MOSFET的RFID技术实现了亚阈值状态下的高速和低功耗应用[1]。深入分析了不同操作模式下存储单元或SRAM电路的SNM,功率和延迟。与双栅极无结MOSFET相比,双材料双栅极无氧化物叠层MOSFET(DMDGS-JLT)显示出令人鼓舞的ION / IOFF比,更低的亚阈值摆幅和更少的漏极感应势垒降低或DIBL。因此,所提出的SRAM单元将有效地提供更少的功耗和更高的速度以及更好的静态噪声余量。对于超低功耗标签设计,已经在亚阈值范围内研究了DMDGS-JLT对实现RFID存储单元或SRAM的影响。使用SILVACO ATLAS平台进行了广泛的仿真,以验证所分析的模型。此外,已经选择了最佳电源电压范围,以获得超低功耗和更高的运行速度。 DMDGS-JLT可以替代超低功耗无源RFID标签设计,从而延长电池的使用时间。

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