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IR-drop Analysis for Validating Power Grids and Standard Cell Architectures in sub-lOnm Node Designs

机译:子伦节点设计中用于验证电网和标准单元架构的红外压降分析

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Since chip performance and power are highly dependent on the operating voltage, the robust power distribution network (PDN) is of utmost importance in designs to provide with the reliable voltage without voltage (IR)-drop. However, rapid increase of parasitic resistance and capacitance (RC) in interconnects makes IR-drop much worse with technology scaling. This paper shows various IR-drop analyses in sub lOnm designs. The major objectives are to validate standard cell architectures, where different sizes of power/ground and metal tracks are validated, and to validate PDN architecture, where types of power hook-up approaches are evaluated with IR-drop calculation. To estimate IR-drops in lOnm and below technologies, we first prepare physically routed designs given standard cell libraries, where we use open RISC RTL, synthesize the CPU, and apply placement & routing with process-design kits (PDK). Then, static and dynamic IR-drop flows are set up with commercial tools. Using the IR-drop flow, we compare standard cell architectures, and analysis impacts on performance, power, and area (PPA) with the previous technology-node designs. With this IR-drop flow, we can optimize the best PDN structure against IR-drops as well as types of standard cell library.
机译:由于芯片的性能和功率高度依赖于工作电压,因此稳健的配电网络(PDN)在设计中提供无电压(IR)下降的可靠电压至关重要。但是,互连中寄生电阻和电容(RC)的快速增加使得IR压降随着技术规模的扩大而变得更加糟糕。本文展示了亚离子设计中的各种红外压降分析。主要目标是验证标准单元架构,以验证不同大小的电源/地线和金属走线,以及验证PDN架构,其中通过IR-drop计算评估电源连接方法的类型。为了估计lonm及其以下技术的IR下降,我们首先准备在给定标准单元库的情况下进行物理布线的设计,在此我们使用开放的RISC RTL,合成CPU并通过工艺设计套件(PDK)应用布局和布线。然后,使用商业工具设置静态和动态IR下降流。使用IR-drop流程,我们将比较标准的单元架构,并使用以前的技术节点设计来分析对性能,功率和面积(PPA)的影响。借助这种IR墨滴流,我们可以针对IR墨滴以及标准单元库的类型优化最佳的PDN结构。

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