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Exploiting expendable process-margins in DRAMs for run-time performance optimization

机译:利用DRAM中的消耗性工艺裕量进行运行时性能优化

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Manufacturing-time process (P) variations and runtime voltage (V) and temperature (T) variations can affect a DRAM's performance severely. To counter these effects, DRAM vendors provide substantial design-time PVT timing margins to guarantee correct DRAM functionality under worst-case operating conditions. Unfortunately, with technology scaling these timing margins have become large and very pessimistic for a majority of the manufactured DRAMs. While run-time variations are specific to operating conditions and as a result, their margins difficult to optimize, process variations are manufacturing-time effects and excessive process-margins can be reduced at run-time, on a per-device basis, if properly identified. In this paper, we propose a generic post-manufacturing performance characterization methodology for DRAMs that identifies this excess in process-margins for any given DRAM device at runtime, while retaining the requisite margins for voltage (noise) and temperature variations. By doing so, the methodology ascertains the actual impact of process-variations on the particular DRAM device and optimizes its access latencies (timings), thereby improving its overall performance. We evaluate this methodology on 48 DDR3 devices (from 12 DIMMs) and verify the derived timings under worst-case operating conditions, showing up to 33.3% and 25.9% reduction in DRAM read and write latencies, respectively.
机译:制造时工艺(P)的变化以及运行时电压(V)和温度(T)的变化会严重影响DRAM的性能。为了应对这些影响,DRAM供应商提供了可观的设计时PVT时序余量,以保证在最坏情况下的工作条件下正确的DRAM功能。不幸的是,随着技术的发展,这些时序裕量已经变得很大,并且对于大多数制造的DRAM来说非常悲观。尽管运行时变化是特定于操作条件的,因此,其余量很难优化,但过程变化是制造时的影响,并且可以在运行时按设备适当地减少过多的过程裕度(如果合适)确定。在本文中,我们提出了一种通用的DRAM制造后性能表征方法,该方法可在运行时识别任何给定DRAM设备在工艺裕量方面的这种过量现象,同时保留电压(噪声)和温度变化的必要裕度。通过这样做,该方法确定了工艺变化对特定DRAM设备的实际影响,并优化了其访问等待时间(时序),从而提高了其整体性能。我们在48个DDR3器件(来自12个DIMM)上评估了这种方法,并验证了在最坏情况下的导出时序,分别显示了DRAM读写延迟分别减少了33.3%和25.9%。

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