首页> 外文会议>Conference on Micromachining and Microfabrication Process Technology IX; Jan 27-29, 2004; San Jose, California, USA >Analysis of a Process for Replication of Electroforming Molds with Integral Microscreens
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Analysis of a Process for Replication of Electroforming Molds with Integral Microscreens

机译:用整体式微筛复制电铸模的过程分析

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A process for the rapid replication of electroforming plastic micromolds has been developed at Sandia National Laboratories, Livermore, CA. The process is based on injection molding of plastic replicates with integral metallic screens to produce sacrificial electroforming molds in which the metallic screen acts as the conducting base and the plastic features provide insulating sidewalls. The process consists of injecting molten PMMA via a center-gate into a disk-shaped mold cavity in which a sandwich of a flow channel plate, porous Nickel foam, and metallic microscreen are placed on top of the LIGA-fabricated tooling. A numerical model for the coupled heat transfer and fluid flow phenomena is used to investigate the effects of various process parameters on the mold-filling behavior. The results from the parametric studies are presented and discussed.
机译:在加利福尼亚州利弗莫尔市的桑迪亚国家实验室,已经开发了一种快速复制电铸塑料微模具的方法。该工艺基于将塑料复制品与一体的金属筛网一起注塑成型,以生产牺牲电铸模具,其中金属筛网充当导电基底,塑料部件提供绝缘侧壁。该过程包括通过中心浇口将熔融的PMMA注入到盘状模腔中,在该模腔中,将流道板,多孔镍泡沫和金属微筛的三明治放置在LIGA制造的模具顶部。耦合传热和流体流动现象的数值模型用于研究各种工艺参数对模具填充行为的影响。提出并讨论了参数研究的结果。

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