机译:电铸过程中具有共面辅助阴极的金属微流体芯片模具的制造
Dalian Univ Technol Key Lab Micro Nano Technol &
Syst Liaoning Prov Dalian 116024 Peoples R China;
Dalian Univ Technol Key Lab Micro Nano Technol &
Syst Liaoning Prov Dalian 116024 Peoples R China;
Dalian Univ Technol Key Lab Micro Nano Technol &
Syst Liaoning Prov Dalian 116024 Peoples R China;
Dalian Univ Technol Key Lab Micro Nano Technol &
Syst Liaoning Prov Dalian 116024 Peoples R China;
Dalian Univ Technol Key Lab Micro Nano Technol &
Syst Liaoning Prov Dalian 116024 Peoples R China;
Dalian Univ Technol Key Lab Micro Nano Technol &
Syst Liaoning Prov Dalian 116024 Peoples R China;
metal microfluidic chip mold; thickness uniformity of micro electroforming; coplanar auxiliary cathode; computer-aided analysis;
机译:电铸过程中具有共面辅助阴极的金属微流体芯片模具的制造
机译:电铸过程中提高微流控芯片模具厚度均匀性的研究
机译:用于微流控芯片加工的模具镶件制造分析
机译:微流片制造中微电铸模插入物的均匀性研究
机译:EWOD微流控芯片的应用:驱动,拉伸流变学,芯片上加热和单片制造的基础知识
机译:电铸过程中改善微流控芯片模具厚度均匀性的研究
机译:提高微流控芯片模具电铸成形厚度均匀性的研究