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Novel LEDs using unique lateral p-n junctions on GaAs (311)A patterned substrates

机译:在GaAs(311)A图案化基板上使用独特的横向p-n结的新型LED

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We report the high-density light-emitting diodes (LEDs) using lateral junction for LED printer and other applications. Semi-insulating GaAs (311)A substrates were patterned to create (100) sidewall. GaAs/Al_xGa_(1-x)As epi-layers were grown on the patterned substrate using the amphoteric silicon as a dopant, which forms the lateral p-n junction. For the first time, high-density (2400 dots per inch) LED arrays were fabricated using the lateral junction with device width of 10.6 micron. Light emission spectrum shows a single peak at a wavelength of 813 nm with FWHM of 56 nm at room temperature. The same method can be used to fabricate LED arrays with higher device densities for applications in high resolution LED printers, displays and other applications.
机译:我们报告了用于LED打印机和其他应用的使用横向结的高密度发光二极管(LED)。对半绝缘GaAs(311)A衬底进行构图以创建(100)侧壁。 GaAs / Al_xGa_(1-x)As外延层使用两性硅作为掺杂剂在图案化的衬底上生长,这形成了侧向p-n结。首次使用具有10.6微米器件宽度的横向结制造了高密度(每英寸2400点)的LED阵列。发光光谱在室温下在813 nm的波长处显示单个峰,FWHM为56 nm。可以使用相同的方法来制造具有更高设备密度的LED阵列,以用于高分辨率LED打印机,显示器和其他应用。

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