Simulation study of the process parameters of a new precision grinding method

摘要

A new method for precision surface grinding which is termed "workpiece modulation" is studied in this paper. Simulations and experiments have shown that workpiece modulation improves ground surface quality. Simulations show that surface texture as quantified by 2D power spectrum for a single pass with modulation is similar to surface texture from a multiple pass grinding operation without modulation. The effect of process parameters of this new process is analyzed by factorially designed simulations. General rules for selecting grinding process parameters for this new method are given based on the simulation.