High Magnetic Field Effects on the Growth Behavior of a Sn-3Ag-0.5Cu/Cu IMC Layer

摘要

The effects of high magnetic field on materials have been intensively studied recently; however, high magnetic field effects upon inmteretallic compound have not been addressed. The effects of high magnetic field on the Sn-3Ag-0.5Cu/Cu IMC growth have been investigated. The Sn-3Ag-0.5Cu/Cu solder joint aged at 170℃ with and without 3T/8T magnetic field. The thickness of the IMC in the couples with treated in the magnetic field was much larger than those without; and the growth was enhanced when the direction of magnetic field and the diffusion of Cu were the same. Furthermore, the thickness of IMC increases more rapidly with the magnetic field intensity is increased.