The Growth Behaviors of IMC Layers at Soldered and Diffusion Bonding Sn/Cu Interfaces and the Effects of High Magnetic Field

Cong qian Cheng; Jie Zhao; Yang Xu; Peng Yang

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The Growth Behaviors of IMC Layers at Soldered and Diffusion Bonding Sn/Cu Interfaces and the Effects of High Magnetic Field

机译：锡和铜键合和扩散界面处IMC层的生长行为和强磁场的影响

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摘要

The growth behaviors of intermetallic compound (IMC) layers in soldered and diffusion bonding Sn/Cu joints and the effects of magnetic field have been investigated. The results indicate that, without high magnetic field, the growth behaviors of these two

机译：研究了金属间化合物（IMC）层在锡焊和扩散焊锡/铜接头中的生长行为以及磁场的影响。结果表明，在没有强磁场的情况下，这两种材料的生长行为

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来源
《Key Engineering Materials》 |2008年第2008期|p.480-483|共4页
作者
Cong qian Cheng; Jie Zhao; Yang Xu; Peng Yang;
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作者单位

School of Materials Science and Engineering, Dalian University of Technology, Dalian 116023, China;

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原文格式 PDF
正文语种 eng
中图分类工程基础科学;
关键词
IMC layers; aging; growth behaviors; high magnetic field;

机译：IMC层;时效;生长行为;高磁场;

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1. Interfacial reaction and growth behavior of IMCs layer between Sn-58Bi solders and a Cu substrate [J] . Xiaowu Hu, Yulong Li, Zhixian Min Journal of materials science . 2013,第6期

机译：Sn-58Bi焊料与Cu衬底之间的IMCs层的界面反应和生长行为
2. Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interface [J] . Zhu Zhidan, Ma Haoran, Shang Shengyan, Journal of materials science . 2019,第17期

机译：多晶铜微结构对Sn / Cu焊接界面IMC生长行为的影响
3. The Effect of High Magnetic Field on the Growth Behavior of Sn-3Ag-0.5Cu/Cu IMC Layer [J] . Jie Zhao, Peng Yang, Feng Zhu Scripta materialia . 2006,第6期

机译：强磁场对Sn-3Ag-0.5Cu / Cu IMC层生长行为的影响
4. The Growth Behaviors of IMC Layers at Soldered and Diffusion Bonding Sn/Cu Interfaces and the Effects of High Magnetic Field [C] . Cong qian Cheng, Jie Zhao, Yang Xu, International Conference on Surface Engineering . 2008

机译：焊接和扩散粘合Sn / Cu接口的IMC层的生长行为及高磁场的影响
5. Liquid-Phase Diffusion Bonding and the Development of a Cu-Ni/Sn Composite Solder Paste for High Temperature Lead-Free Electrical Connections [D] . Choquette, Stephanie Michele. 2018

机译：液相扩散键合和用于高温无铅电气连接的Cu-Ni / Sn复合焊膏的开发
6. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions [O] . Ai Ting Tan, Ai Wen Tan, Farazila Yusof 2015

机译：纳米粒子添加对不同热条件下Cu / Sn-Ag-Cu / Cu焊点中金属间化合物（IMCs）的形成和生长的影响
7. Growth behavior of IMCs layer between Sn-3.0Ag-0.5Cu solder and Cu substrate during aging [O] . Min Qu, Tianze Cao, Yan Cui, 2018

机译：SN-3.0AG-0.5CU焊料和Cu基质在老化期间IMCS层的生长行为

The Growth Behaviors of IMC Layers at Soldered and Diffusion Bonding Sn/Cu Interfaces and the Effects of High Magnetic Field

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