首页> 外文会议>Annual International Conference on Compound Semiconductor MANufacturing TECHnology(CS MANTECH); 20060425-27; Vancouver(CA) >Recent Achievements in SopSiC substrates for High Power and High Frequency Applications
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Recent Achievements in SopSiC substrates for High Power and High Frequency Applications

机译:用于大功率和高频应用的SopSiC衬底的最新成就

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摘要

Engineered Substrates is an established material in the silicon industry. Engineered substrates enable the optimization of the active device, the top layer and the bulk independently. Today we present the development of Silicon silicon on poly-crystalline Silicon silicon Carbide carbide (SopSiC) substrate obtained by the Smart Cut~(TM) technology. SopSiC substrate structure combines the advantages of Silicon and SiC materials. Compared to the conventional SiC single crystal approach, this innovative approach offers a larger diameter substrate and a lower cost solution. SopSiC substrates are proposed to support the development and future industrialization of GaN microelectronics for commercial and military applications. The recent results, presented hereafter, show that materials could cover various areas from high frequency to high power devices such as AlGaN/GaN transistors.
机译:工程衬底是硅行业中的一种成熟材料。工程衬底可以独立地优化有源器件,顶层和主体。今天,我们介绍了通过Smart Cut〜(TM)技术在多晶硅碳化硅(SopSiC)衬底上进行硅硅的开发。 SopSiC衬底结构结合了硅和SiC材料的优点。与传统的SiC单晶方法相比,该创新方法可提供更大直径的基板和更低的解决方案。提出了SopSiC衬底来支持GaN微电子在商业和军事应用中的发展和未来的工业化。此后呈现的最新结果表明,材料可以覆盖从高频到高功率器件(例如AlGaN / GaN晶体管)的各个领域。

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