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Wideband characterization of aluminum nitride substrates and high-power-high-frequency thick film applications.

机译:氮化铝基板的宽带表征和高功率高频厚膜应用。

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摘要

Ceramic substrates play an important role in thick film hybrid microelectronic circuits. Existing substrates such as alumina and beryllia do not meet satisfactorily the desired requirements. The newly developed aluminum nitride (AlN) substrate shows a great deal of promise and potentially embraces the best qualities of alumina and beryllia.;The objective of this dissertation is to study the electrical properties, thick film interaction, and environmental effects on AlN substrates, and also to examine the performance of this material for high power - high frequency hybrid thick film applications. In particular, wideband dielectric constant measurements of AlN and other ceramic substrates are performed, oxidization and humidity effects on surface properties of AlN are addressed, and short and long term aging effects on several circuit parameters are studied.;To evaluate the performance of AlN in high power and high frequency applications, two circuits; an impulse generator and a power converter, are realized, tested and compared with those on alumina substrates. The thick film circuits realized on AlN perform considerably better than those on alumina.
机译:陶瓷基板在厚膜混合微电子电路中起着重要作用。现有的基材,例如氧化铝和氧化铍,不能令人满意地满足所需的要求。新开发的氮化铝(AlN)衬底具有广阔的前景,并有望包含氧化铝和氧化铍的最佳质量。本论文的目的是研究AlN衬底的电性能,厚膜相互作用和环境影响,并研究这种材料在高功率-高频混合厚膜应用中的性能。特别是,对AlN和其他陶瓷衬底进行宽带介电​​常数测量,研究了氧化和湿度对AlN表面性能的影响,研究了几种电路参数的短期和长期老化效应。大功率和高频应用,两个电路;脉冲发生器和功率转换器被实现,测试并与氧化铝基板上的脉冲发生器和功率转换器进行了比较。在AlN上实现的厚膜电路比在氧化铝上的性能好得多。

著录项

  • 作者

    Farzanehfard, Hosein.;

  • 作者单位

    Virginia Polytechnic Institute and State University.;

  • 授予单位 Virginia Polytechnic Institute and State University.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 1992
  • 页码 207 p.
  • 总页数 207
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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