首页> 外文会议>Annual International Conference on Compound Semiconductor MANufacturing TECHnology(CS MANTECH); 20050411-14; New Orleans,LA(US) >HBr-based gas cluster ion beam smoothing as a final polish for the production of MBE-epi-ready GaSb wafers
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HBr-based gas cluster ion beam smoothing as a final polish for the production of MBE-epi-ready GaSb wafers

机译:基于HBr的气体团簇离子束平滑处理,作为生产MBE-epi就绪的GaSb晶片的最终抛光剂

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摘要

For the first time, a gas cluster ion beam (GCIB) process incorporating Br gas was successfully used on GaSb (100) as a surface preparation technique for molecular beam epitaxy (MBE). Thermal X-ray photoelectron spectroscopy (TXPS) revealed that the surface oxide layer contained bonded bromine which was liberated at ~400 ℃ and Sb-oxides that were liberated at ~500 ℃, leaving mostly Ga-oxides. Reflection high energy electron diffraction (RHEED) analysis within the MBE growth chamber showed a standard 1×3 reconstruction pattern in a Sb overpressure, confirming that Ga-oxides were desorbed by 530 ℃, leaving a smooth single crystal surface for epitaxial growth. In addition, the episurfaces of the Br-GCIB finished surfaces showed uniform step-terrace formations as compared to the swirled step terrace episurfaces grown on chemical mechanical polishing (CMP) finished surfaces.
机译:首次,在GaSb(100)上成功地将结合了Br气体的气体团簇离子束(GCIB)工艺用作分子束外延(MBE)的表面制备技术。 X射线热电子能谱(TXPS)显示,表面氧化物层含有在〜400℃释放的键合溴和在〜500℃释放的Sb-氧化物,大部分残留Ga-氧化物。 MBE生长室内的反射高能电子衍射(RHEED)分析显示,在Sb超压下,标准的1×3重建模式,证实了Ga氧化物在530℃下解吸,留下了光滑的单晶表面用于外延生长。此外,与在化学机械抛光(CMP)精加工表面上生长的旋涡台阶台面表面相比,Br-GCIB精加工表面的外表面显示出均匀的阶梯形台阶。

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