Properties of a novel silver sintering die attach material for high temperature - high lifetime applications

摘要

Silver sintering technology has proven to be a high reliable alternative for solder die attaches as wellrnas wire bonding. Previous work at Fraunhofer IISB showed as well a rise in passive temperaturerncycling capability as in active temperature cycling lifetime with power electronic test modulesrncompared to soldered and wire bonded samples. Since it is a new die attach technology, thernmaterial’s properties are still not yet well know. In this work, the Young’s modulus will be investigatedrnfor two different silver sinter pastes depending on mounting parameters and proceeding materialrnfatigue during passive temperature cycling.