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Growth of low-defect AlGaN by lateral epitaxy over V-grooved sapphire substrates fabricated by wet chemical etching

机译:通过湿法化学刻蚀在V槽蓝宝石衬底上通过侧向外延生长低缺陷AlGaN

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Low-defect AlGaN films were grown by metal organic chemical deposition (MOCVD) over patterned sapphire substrates (PSS) with V-grooves fabricated by wet chemical etching based on a mixed solution of H_2SO_4 and H_3PO_4. Three high-temperature (HT) growth steps were performed on the wet-etched PSS. In the 1st HT-growth step, GaN layers with triangular cross-sections were grown on sapphire mesas of the surface of the wet-etched PSS. In the 2nd HT-growth step, the GaN layers were more grown in the lateral direction and coalescent at the bottom, but corrugated at the surface. Finally, in the 3rd HT-growth step, AlGaN layer was grown on the corrugated surface of GaN and coalesced completely into AlGaN layer with flat surface. By employing the corrugated surface of GaN grown on the wet-etched PSS as the initial surface for the growth of AlGaN layers, the tensile stress of AlGaN was remarkably reduced. Additionally, in order to completely eliminate the cracks of the AlGaN layer, a low-temperature (LT) AlN layer was inserted between the AlGaN layer and the GaN layer with the corrugated surface. By inserting the LT-AlN interlayer, no crack did generate in the AlGaN film, and the density of threading dislocations in the film was remarkably decreased after the lateral epitaxy using the wet-etched PSS with V-grooves.
机译:通过在基于H_2SO_4和H_3PO_4混合溶液的湿法化学蚀刻制成的V形沟槽的蓝宝石衬底(PSS)上,通过金属有机化学沉积(MOCVD)来生长低缺陷AlGaN膜。在湿蚀刻的PSS上执行了三个高温(HT)生长步骤。在第一HT生长步骤中,在湿法蚀刻的PSS表面的蓝宝石台面上生长具有三角形横截面的GaN层。在第二个HT生长步骤中,GaN层在横向方向上更多地生长,并在底部聚结,但在表面起皱。最后,在第三个HT生长步骤中,在GaN的波纹表面上生长AlGaN层,并将其完全合并为具有平坦表面的AlGaN层。通过将在湿蚀刻的PSS上生长的GaN的波纹表面用作AlGaN层生长的初始表面,可以显着降低AlGaN的拉伸应力。另外,为了完全消除AlGaN层的裂纹,在具有波纹表面的AlGaN层和GaN层之间插入了低温(LT)AlN层。通过插入LT-AlN中间层,在AlGaN膜中不会产生裂纹,并且在横向外延后使用带V槽的湿法刻蚀PSS可以明显降低膜中的螺纹位错密度。

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