首页> 外文会议>8th International Conference on Radiation Curing May 15-19, 2001 Kunming, China >Study on Liquid Alkali Developing Type Solder Resists: Reaction of Dibasic Acid Half-ester with Epoxy Compound
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Study on Liquid Alkali Developing Type Solder Resists: Reaction of Dibasic Acid Half-ester with Epoxy Compound

机译:液态碱显影型阻焊剂的研究:二元酸半酯与环氧化合物的反应

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Reaction of dibasic acid half-ester with epoxy compound, which is applied on the technology of liquid alkali developing type solder resists, was investigated in this paper. The half-esters of maleic acid, succinic acid, phthalic acid, cis-1,2,3,6-tetrahydrophthalic acid and cis-hexahydrophthalic acid were used as model compounds. N,N-dimethyl benzylamine, 1-methylimidazole, tetramethyl ammonium bromide and chromium acetylacetonate(CrAA) were used as catalysts. Kinetics behavior of the reaction has been researched. It is found that maleic acid monomethyl ester and Phthalic acid monomethyl ester show relatively high reactivity in most cases. Smaller molecular size is favorable for CrAA catalyzed reaction. Acidity and molecular size of dibasic acid half-ester are two factors that affects the reactivity of the half-ester.
机译:研究了应用于液体碱显影型阻焊剂技术的二元酸半酯与环氧化合物的反应。马来酸,琥珀酸,邻苯二甲酸,顺式1,2,3,6-四氢邻苯二甲酸和顺式六氢邻苯二甲酸的半酯用作模型化合物。 N,N-二甲基苄胺,1-甲基咪唑,四甲基溴化铵和乙酰丙酮铬(CrAA)用作催化剂。已经研究了反应的动力学行为。发现在大多数情况下,马来酸单甲酯和邻苯二甲酸单甲酯显示出相对较高的反应性。较小的分子尺寸对于CrAA催化的反应是有利的。二元酸半酯的酸度和分子大小是影响半酯反应性的两个因素。

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