FORMATION OF SOLDER RESIST USING ALKALI DEVELOPED SOLDER RESIST INK

摘要

PURPOSE: To leave a resist film between conductor circuits by a method wherein alkali developed solder resist ink having a specified composition is applied on the whole surface of a substrate with the conductor circuits, heated, dried and after irradiation with ultraviolet ray the resist film only existing on the conductor circuits is developed with an alkaline aqueous solution. ;CONSTITUTION: A high-acid value and high-molecular weight resin not containing a photosensitive group is dissolved in a solvent, a photo-setting monomer, a photopolymerization initiator, an epoxy resin and an epoxy hardening agent are added to the high-acid value and high- molecular weight resin, the high-acid value and high-molecular weight resin, the monomer, the initiator, the epoxy resin and the hardening agent are mixed and the mixture is uniformly made to disperse by a roll mill to form alkali developed solder resist ink. The above ink is applied on the whole surface of a substrate 1 with conductor circuits 2 formed thereon, is heated and dried and a coating film 3 is formed. A negative film 4 having a transparent part 4 and a light-shielding part 4b is aligned with the substrate 1 in such a way that prescribed regions on the circuits 2 are light-shielded to place on the substrate 1 and when ultraviolet ray 5 are irradiated, the coating film of exposed parts is hardened. Then, the coating film 3 is subjected to treatment with an alkaline aqueous solution, the coating film 3 only existing on the circuits 2 out of the coating film 3 under the light-shielding part is removed by developing and the other coating film (a resist film 6) can be made to remain.;COPYRIGHT: (C)1995,JPO