Use of Non-conductive Film (NCF) with Nano-Sized Filler Particles for Solder Interconnect: Research and Development on NCF Material and Process Characterization

摘要

As three-dimensional Through-Silicon Via (3D-TSV) packaging is emerging in the semiconductor market to integrate multiple functions in a system for further miniaturization, thermal compression bonding (TCB), which stacks multiple bare chips on top of each other with Cu pillar bumps with solder cap, has become an indispensable new packaging technology. The novel non-conductive film (NCF) described in this paper is an epoxy-type thermosetting material in film form, with lower density of Nano-sized silica filler particles (average particle size is 100 Nano meters). Advantages of this NCF material with Nano-sized fillers include: transparency of the NCF material so that the TCB bonder's image recognition system can easily identify fiducial marks on the chip, ability of the Nano-filler to flow out with the NCF resin during thermal compression bonding, to mitigate filler entrapment between solder joints, which is critical to ensure reliable solder connections, compatibility with fine pitch applications with extremely narrow chip-to-chip and chip-to-substrate gaps to form void-free underfill. Instead of the previous processes of die attach, fluxing, traditional oven mass re-flow, flux cleaning, and capillary underfill (CUF), the current process involves the use of NCF & TCB. The NCF is applied on a wafer in a film form by lamination, and then a wafer is diced with the pre-laminated NCF in pieces. Then they are joined by TCB, with typical parameters of 250°C for 10 seconds with 80N (solder cap on 15μm diameter Cu pillar, 40μm pitch, 1000 bumps). NCF heated by TCB is quickly liquidized to lower its viscosity after a few seconds. Other advantages of NCF is that it has a fluxing function included in the material, which eliminates the need for separate flux apply and flux clean steps, which simplifies process and costs. Also, NCF can control extrusion along the package's edge line since NCF is a half-cured B-stage material which has some mechanical rigidity during handling and lamination. Thus NCF Thermal Compression Flip Chip Bonding method is the vital solution to ensure good reliability with mass productivity for next generation's packaging. The characterization of NCF material and the importance of controlling viscosity and elastic modulus during thermal-compression will be analyzed and discussed in this paper. Process and reliability data on test vehicles will be shown.